6 Months
Offline Classes
This course provides end-to-end understanding of semiconductor process integration, connecting individual fabrication steps into a complete, manufacturable device flow.
You will learn:
Complete semiconductor process flows
Interaction between lithography, etch, deposition, and CMP
Device structures and technology scaling challenges
Integration-driven yield and reliability considerations
The program equips learners with fab-ready integration skills expected from Integration Engineers in semiconductor manufacturing and R&D teams.
By the end of this course, you will be able to:
Course Fee
No Cost EMI Option
Pay After Placement Option
Merit Based Discount Option Upto 50%
Take online test for 90 mins with 60 MCQs. Syllabus includes Aptitude, Digital Electronics, Electronic Devices.
Enroll in the course, if selected. Start your preparation by getting access to the pre-requisite materials.
At ChipXpert VLSI Training Institute, our Placement Desk is dedicated to bridging the gap between skilled engineers and top-tier VLSI companies. We work closely with both multinational corporations (MNCs) and service companies in the semiconductor industry to fulfill their entry-level hiring needs. Our strong industry collaborations ensure that our trained engineers have access to a wide range of job opportunities.
We offer comprehensive placement assistance as part of our training package. From resume building and interview preparation to arranging direct interviews with hiring companies, our support continues until candidates secure their desired positions. Additionally, we stay in constant touch with recruiters to ensure our students are matched with roles that best suit their skills and aspirations.
Our placement desk also offers personalized guidance for job seekers, including industry-specific tips and insights to help them excel during interviews. Candidates are encouraged to register with the placement desk for dedicated support throughout their job search. For further details or to start the placement process, please reach out to our Learning Advisor.
A Packaging and Testing Engineer is responsible for assembling semiconductor chips into protective packages and ensuring their performance, reliability, and quality through rigorous electrical and functional testing before mass production and market release.
This course is ideal for B.E / B.Tech / M.Tech students, diploma holders, fresh graduates, and working professionals in Electronics, Electrical, ECE, EEE, or related disciplines who want to build a career in semiconductor fabrication, packaging, and testing.
You will gain hands-on knowledge in IC packaging technologies, wafer probing, assembly processes, testing methodologies, failure analysis, quality control, and industry-standard tools used in semiconductor manufacturing and testing environments.
Yes. The course includes practical sessions, real-world case studies, process flow understanding, and industry-oriented training designed to make learners job-ready for roles in semiconductor fabs, OSAT companies, and testing facilities.
After completing the course, you can pursue roles such as Packaging Engineer, Test Engineer, Product Engineer, Yield Engineer, or Quality Engineer in leading semiconductor manufacturing, fabrication, and testing companies in India and abroad.
