Become a Skilled Process Engineer for Semiconductor & Nano Fabrication Industry

Process Engineer

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Start Date

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Duration

6 Months

Training Type

Offline Classes

Course Overview – Nano Fab Process Engineer Program

The Nano Fab Process Engineer Course focuses on the end-to-end semiconductor manufacturing cycle, from raw silicon wafer preparation to final device fabrication.

You will gain in-depth knowledge of:

  • Semiconductor materials & physics

  • Cleanroom protocols

  • Lithography, deposition, etching & diffusion

  • Process monitoring, control, and yield improvement

  • Equipment basics used in fabrication facilities

This program bridges the gap between theoretical semiconductor concepts and practical fab-level execution.

Why Choose the Process Engineer Nano Fab Course at ChipXpert?

Key Learning Outcomes

By the end of this course, you will be able to:

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Course Delivery Model

Course Duration & Timings

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Nano Fabrication – Process Engineer

Course Syllabus

  • Overview of semiconductor manufacturing
  • Top-down vs bottom-up fabrication
  • Moore’s law and technology scaling
  • Role of a Process Engineer
  • Cleanroom classes and standards
  • Contamination control
  • Gowning procedures
  • Chemical and gas safety
  • Silicon crystal growth
  • Wafer orientation and types
  • SOI, GaAs, SiC basics
  • RCA cleaning
  • Wet and dry cleaning
  • Surface preparation
  • Thermal oxidation
  • CVD (LPCVD, PECVD)
  • PVD (Sputtering, Evaporation)
  • ALD fundamentals
  • Photoresists
  • Mask alignment
  • Exposure systems
  • Overlay control
  • Wet etching
  • Dry etching
  • RIE and DRIE
  • Diffusion
  • Ion implantation
  • Annealing
  • CMP fundamentals
  • Slurry and pad
  • Defect control
  • Optical inspection
  • SEM, AFM basics
  • Film thickness measurement
  • Wafer dicing
  • Wire bonding
  • Flip chip
  • Basic device fabrication flow
  • Process documentation
  • Failure analysis

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Who should join this course?

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Placement Coordinator

Placement Assistance

At ChipXpert VLSI Training Institute, our Placement Desk is dedicated to bridging the gap between skilled engineers and top-tier VLSI companies. We work closely with both multinational corporations (MNCs) and service companies in the semiconductor industry to fulfill their entry-level hiring needs. Our strong industry collaborations ensure that our trained engineers have access to a wide range of job opportunities.

We offer comprehensive placement assistance as part of our training package. From resume building and interview preparation to arranging direct interviews with hiring companies, our support continues until candidates secure their desired positions. Additionally, we stay in constant touch with recruiters to ensure our students are matched with roles that best suit their skills and aspirations.

Our placement desk also offers personalized guidance for job seekers, including industry-specific tips and insights to help them excel during interviews. Candidates are encouraged to register with the placement desk for dedicated support throughout their job search. For further details or to start the placement process, please reach out to our Learning Advisor.

FAQ

Nano Fabrication - Process Engineer

The Process Engineer Nano Fab Course is a specialized training program focused on semiconductor fabrication and nano-scale manufacturing. It covers wafer processing, cleanroom operations, lithography, deposition, etching, and process control techniques used in semiconductor fabrication facilities.

This course is suitable for B.Tech, M.Tech, and MSc students from ECE, EEE, Physics, Nanotechnology, and related branches. It is also ideal for fresh graduates and working professionals who want to build a career in semiconductor manufacturing and fabrication roles.

No prior fab experience is required. The course starts with fundamentals and gradually advances to fab-level processes, making it beginner-friendly while still relevant for professionals.

You will gain practical knowledge of semiconductor materials, wafer fabrication steps, cleanroom protocols, lithography, thin-film deposition, etching, diffusion, implantation, and process control methods used in real-world fabs.

Yes. The course provides detailed understanding of cleanroom classification, contamination control, safety procedures, and core fabrication processes followed in semiconductor manufacturing environments.

Why Choose ChipXpert

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